Advanced Semiconductor Packaging Automation
BGA/CSP Solder Ball Mount Automation
Model : AU-800
The AU-800 is a fully automated ball-grid-array (BGA) & chip-scale-package (CSP) solder ball placement system. Developed for today’s challenge & tomorrow’s technology, the AU-800 supports a wide variety of BGA types & formats.
With superb ability to handle large ball counts using proprietary techniques, the AU-800 offers increased throughput with high levels of uptime. Its unique solder ball handling design eliminates double ball and prevents damage to the solder balls.
The AU-800 operates on a high-rigidity platform with high accuracy motion systems specially configured for highly repeatable and accurate placement. Coupled with vision-guide features, the AU-800 allows enhanced fine-pitch placement performance without the need to create special fiducial patterns ... thereby allowing vision-guided placement on all types of BGA formats including singulated packages as well as strip-based packages.
Integrated with Pre- and Post-Inspection features, the AU-800 further ensures only quality products are released for down-stream processes.
The AU-800 ball mount tooling comprises only few items ... allowing for package conversion time as short as 5 minutes while ensuring low tooling cost.
With modular design, the AU-800, coupled with its substrate handling modules, can be easily configured with a wide range of reflow oven and/or cleaner to form an integrated solder ball attach line for high volume production.
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AURIGIN TECHNOLOGY PTE
Blk 4010 Ang Mo Kio Ave 10 #06-10,11,12 TECHplace I Singapore 569626
Phone : 65-64556011
Fax : 65-62339174
Email : email@example.com
|Last Update 22-Jun-2017|
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